Xiaomi has sent out an invite for the Mobile World Congress 2019. The Chinese OEM has scheduled its MWC event on Feb 24. The company is yet to reveal the phones that will be launching at the event but rumours mostly hint at Mi Mix 3 5G. Other rumours suggest that Xiaomi could be launching its 2019’s flagship aka Mi 9 also in Feb, but there’s no timeline revealed yet. We expect Xiaomi to announce the Mi 9 at the MWC event. The possibilities are indeed high for this to happen. Whether or not the Mi 9 launches at MWC 2019 event Xiaomi will definitely unveil the smartphone soon enough considering the rumours and leaks about the device flooding the internet.
First renders of the Mi 9 have been leaked and they show the phone from almost all angles. The near bezel-less phone looks stunning, especially from the front thanks to clean and pretty well-designed waterdrop notch. Unlike the Mi Play or the Redmi Note 7 the teardrop notch on the Mi 9 appears to be smaller and which in turn reduces the bezels on all sides of the phone. This otherwise means more screen-to-body-ratio and better viewing angles.
The bezels on the sides of the Xiaomi Mi 9 are almost negligible. In fact the chin is also extremely thin. There’s no physical fingerprint sensor on the front or on the back, this clearly hints at the in-display fingerprint sensor. Earlier this week Xiaomi CEO showcased the next gen UD fingerprint sensor which the company says is fast and reliable. We expect Xiaomi to use this fingerprint sensor technology in the Mi 9 considering it’s the flagship by the company.
Coming back to the renders of the Mi 9, they show the phone in blue paint which means like the Mi Play and Redmi Note 7 the Mi 9 could also come in funky colours. Renders reveal the back panel design of the phone, looks like the body of the Mi 9 will be made of glass. The renders go in line with the rumours and show the Mi 9 with triple rear cameras wherein two cameras are sit inside a cylindrical setup parted by a flash. While the third camera sits separately on the back panel, right below the two cameras.
Another leak reveals some of the key specs of the upcoming Xiaomi Mi 9. On the camera front, the Mi 9 comes with a primary camera of 48MP sensor, secondary camera of 18MP sensor and third camera of 8MP sensor. While on the hardware the Xiaomi Mi 9 is said to be powered by Qualcomm’s Snapdragon 855 chipset with X24 modem. The new leak reveals two Xiaomi devices with model numbers — M1902F1T/A and MI1903F2A. One of them could be Mi 9 while the other one is said to be the Mi 9 SE. Some analysts predict that the successor to the Mi 8 SE, aka Mi 9 SE may come with 6-inch display and be powered by the successor to the Snapdragon 710 chipset, aka Snapdragon 7150 chipset.